The first domestically-produced chip, precise error correction! TWSC 2985 series from Techwinsemi: storage controller chip supporting 4K LDPC technology

TWSC2985 V4.pngWith the increasing demand for data storage driven by mobile computing and AI technology, Techwinsemi has successfully developed the first domestic SD6.0 standard TWSC2985 series storage controller chip equipped with 4K LDPC error correction technology, leveraging its deep expertise in flash memory technology and module independent research and development. This chip, with its innovative design and excellent performance, provides efficient and reliable storage support for various scenarios such as mobile devices, drones, security monitoring, and in-car recording, effectively addressing the complex and changing storage challenges of the big data era.

 

As the first domestic SD6.0 series storage chip supporting 4K LDPC error correction technology, it adopts the industry-leading UBER 1e-15 level error correction algorithm. Without affecting data throughput and access speed, it finely corrects and accurately corrects data stored on 3D TLC, QLC, and other flash memory particles, significantly improving data integrity and accuracy in high-density storage environments. Even in harsh conditions, it ensures the safe and lossless storage of critical information such as drone images, surveillance videos, and vehicle data.

 

The device is durable and reliableHighly customizableSupports multiple IO modes.

Demonstrates powerful customized hardware compatibility and flexibility, supporting various IO modes such as LTT, CTT, and SSTL. It features built-in VREF, ODT functions, and supports RE&DQS differential mode, further enhancing data transmission stability and accuracy.

 

Satisfying error correction requirements for 144/176 layers and above 200 layers.

Innovatively combining advanced methods of soft decision-making and hard decision-making ensures precise control over existing complex flash memory characteristics. This approach not only provides a flash memory solution for current high-density 144/176-layer and deeper (over 200-layer) 3D TLC/QLC NAND flash memory technologies but also anticipates future developments in the next 3 to 5 years. This feature allows the series of chips to confidently address the increasingly stringent storage challenges in data-intensive applications such as Industry 4.0 smart manufacturing and intelligent transportation systems, maintaining data integrity and system reliability.

 

Supporting the latest ONFI 4.0 protocol

This series of chips support the ONFI 4.0 interface protocol and are backward compatible with older modes such as SDR, NV_DDR2, and NV_DDR3. This ensures seamless integration with existing storage systems, effectively reducing the cost burden for users when upgrading their devices.

 

 

Performance is fully upgraded at full speedEfficient energy-saving

The maximum I/O speed can reach up to 200 MT/s.

The Techwinsemi  R&D team adopts mature industry production processes, achieving independent control from architecture design, firmware algorithm development to chip layout design. This series of chips is mainly based on the 40-nanometer advanced process technology and multi-voltage low-power design methods, through efficient data transmission architecture and optimized cache management, achieving a maximum I/O speed of 200MT/S. Combined with Techwinsemis fully self-developed "ACCM" NAND Flash management algorithm, overall performance is significantly enhanced.

 

Stable operation is ensured within a wide temperature range of -20°C to 85°C.

After undergoing rigorous reliability testing, this series of chips operates stably within a wide temperature range of -20°C to 85°C. They handle large data tasks such as high-definition imaging and continuous video processing quickly, achieving low latency and high energy efficiency. This ensures users experience efficient and energy-saving performance.

 

This series of chips, with features including 4K LDPC error correction technology, extensive hardware compatibility, enhanced performance, and wide temperature stability, provides efficient, reliable, durable, and energy-efficient storage solutions for consumer applications such as mobile devices, aerial drones, surveillance systems, and automotive recording. They not only set a new benchmark for addressing the challenges of the big data era but also highlight Techwinsemis profound expertise and continuous innovation in flash memory technology, opening up new horizons in data storage for users.

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